| T.R | Title | User | Personal
Name | Date | Lines |
|---|
| 43.1 | WCMP METALS TESTS | SUBPAC::DANOCONNOR | | Wed May 07 1997 11:24 | 48 |
|
Auriga Testing 5/5/97 - 5/6/97
Single Head testing (Carrier 1 only)
Modified Oxide Polish Process:
Table: 45 rpm
Flow: 550/550
Carrier: 13 rpm
Pressure: 100 lbs
Pre Citric Treatment
Preflow: 999 / 25 sec
Polish: 750 / 30 sec / 100 lbs
Rinse: 999 / 20 sec / 80 lbs
Preflow: 999/999 / 20 sec / 80 lbs
Post Citric Treatment
Post Flow: 999 / 15 sec / 100 lbs
Polish 750 / 17 sec / 100 lbs
SCRUB = SCRUB ON SPEEDFAM WITH CITRIC VS. NO SCRUB ON SPEEDFAM
Run Information
---------------
Run # Recipe Wafer PreCit PostCit Scrub Particles
WCMP RECIPE ON SCRUBBER WITH CITRIC ON BRUSHES
1 Int_FPM M8382M2 N N Y 248/668/48/0
2 Int_C_Pre M9382L2 Y N Y 345/884/80/6.17
3 Int_C_Pst M8383D2 N Y Y 375/984/71/0
4 C_Pre_Pst M0382V2 Y Y Y 399/1056/91/0
5 FPM_No_Sc M048442 N N N 364/849/91/0
6 Pre_C_Nsc MP381P2 Y N N 329/850/96/0
7 Pst_C_Nsc MM38472 N Y N 381/1022/100/1.02
8 Pr_Pst_Ns MA384J2 Y Y N 398/1018/83/4.13
DRY PROGRAM ON SCRUBBER USED
9 Pr_Pst_Ns MR38202 Y Y N 2157/7420/421/34.5
10 Pst_C_Nsc MR38432 N Y N 1510/3765/272/10.8
11 Pre_C_Nsc MR383U2 Y N N MAXED
12 FPM_No_Sc MY382X2 N N N MAXED
13 C_Pre_Pst MZ381E2 Y Y Y 1035/2214/133/5.42
14 Int_C_Pst MZ383D2 N Y Y 1115/2556/187/2.18
15 Int_C_Pre MU38402 Y N N 2218/6158/586/11.6
16 PARTICLE MONITOR 12K - SCRUB ONLY 5/56/0/0
|
| 43.2 | Citric Testing Initial Results Fe only | SUBPAC::DANOCONNOR | | Wed May 14 1997 10:47 | 55 |
| <<< ASDG::DISK$SYS_DATA:[NOTES$LIBRARY]CMP.NOTE;1 >>>
-< CMP >-
================================================================================
Note 43.1 CMP.D1 PROCESS DATA/PD 1 of 1
SUBPAC::DANOCONNOR 48 lines 7-MAY-1997 11:24
-< WCMP METALS TESTS >-
--------------------------------------------------------------------------------
Auriga Testing 5/5/97 - 5/6/97
Single Head testing (Carrier 1 only)
Modified Oxide Polish Process:
Table: 45 rpm
Flow: 550/550
Carrier: 13 rpm
Pressure: 100 lbs
Pre Citric Treatment
Preflow: 999 / 25 sec
Polish: 750 / 30 sec / 100 lbs
Rinse: 999 / 20 sec / 80 lbs
Preflow: 999/999 / 20 sec / 80 lbs
Post Citric Treatment
Post Flow: 999 / 15 sec / 100 lbs
Polish 750 / 17 sec / 100 lbs
SCRUB = SCRUB ON SPEEDFAM WITH CITRIC VS. NO SCRUB ON SPEEDFAM
Run Information
---------------
Run # Recipe Wafer PreCit PostCit Scrub Fe Particles
WCMP RECIPE ON SCRUBBER WITH CITRIC ON BRUSHES
1 Int_FPM M8382M2 N N Y 88 248/668/48/0
2 Int_C_Pre M9382L2 Y N Y 91 345/884/80/6.17
3 Int_C_Pst M8383D2 N Y Y 16 375/984/71/0
4 C_Pre_Pst M0382V2 Y Y Y 17 399/1056/91/0
5 FPM_No_Sc M048442 N N N 115 364/849/91/0
6 Pre_C_Nsc MP381P2 Y N N 124 329/850/96/0
7 Pst_C_Nsc MM38472 N Y N 60 381/1022/100/1.02
8 Pr_Pst_Ns MA384J2 Y Y N 82 398/1018/83/4.13
DRY PROGRAM ON SCRUBBER USED
9 Pr_Pst_Ns MR38202 Y Y N 9750 2157/7420/421/34.5
10 Pst_C_Nsc MR38432 N Y N 1600 1510/3765/272/10.8
11 Pre_C_Nsc MR383U2 Y N N 1300 MAXED
12 FPM_No_Sc MY382X2 N N N 22400 MAXED
13 C_Pre_Pst MZ381E2 Y Y Y 980 1035/2214/133/5.42
14 Int_C_Pst MZ383D2 N Y Y 1870 1115/2556/187/2.18
15 Int_C_Pre MU38402 Y N N 24500 2218/6158/586/11.6
16 PARTICLE MONITOR 12K - SCRUB ONLY 42 5/56/0/0
|
| 43.3 | Revised Auriga Citric Testing Results 5/14/97 | SUBPAC::DANOCONNOR | | Wed May 14 1997 11:42 | 96 |
| Run Information
---------------
When Using Citric (1%) on the Ontrak Scrubber
- Citric (1%) on the table before polishing does not significantly reduce iron
contamination levels.
- Citric (1%) on the table after the oxide buff process does significantly
reduce the iron contamination levels.
- The 11 sec Speedfam scrub process (with 1% citric) does significantly reduce
the iron contamination levels.
- The speedfam scrub system does not reduce final defectivity levels.
When using the Dry Program on the Ontrak Scrubber
- Citric (1%) on the table before polishing does not significantly reduce iron
contamination levels.
- Citric (1%) on the table after the oxide buff process does significantly
reduce the iron contamination levels when the Speedfam scrub is used.
- The 11 sec Speedfam scrub process (with 1% citric) does significantly reduce
the iron contamination levels. An order of magnitude reduction in
contamination level is seen.
Relatively high levels of Ar were seen on nearly all samples (Including across
the Speedfam scrub split) The source could be the speedfam process itself (first
speedfam results) or the Met202 material.
We have demonstrated the ability to reduce Fe contamination levels to below
1.6E11/cm2 which is much lower than that reported in the industry. (Other than
HF dip use)
We can now work to reduce the impact on the systems and troughput and minimize
chemical usage and defectivity.
Based upon these results I would prioritize the following testing:
1) Speedfam scrub station optimization : Time / Citric Flow as variables
2) Post oxide buff Citric addition
3) OnTrak Scrub station : Citric / NH4OH usage
(Per Speedfam & Sematech we should maintain lower defectivity levels if NH4OH
were used rather than Citric)
Auriga Testing 5/5/97 - 5/6/97
Single Head testing (Carrier 1 only)
Modified Oxide Polish Process:
Table: 45 rpm
Flow: 550/550
Carrier: 13 rpm
Pressure: 100 lbs
Pre Citric Treatment
Preflow: 999 / 25 sec
Polish: 750 / 30 sec / 100 lbs
Rinse: 999 / 20 sec / 80 lbs
Preflow: 999/999 / 20 sec / 80 lbs
Post Citric Treatment
Post Flow: 999 / 15 sec / 100 lbs
Polish 750 / 17 sec / 100 lbs
SCRUB = SCRUB ON SPEEDFAM WITH CITRIC VS. NO SCRUB ON SPEEDFAM
Run # Recipe Wafer PreCit PostCit Scrub Fe Particles
WCMP RECIPE ON SCRUBBER WITH CITRIC ON BRUSHES
1 Int_FPM M8382M2 N N Y 88 248/668/48/0
2 Int_C_Pre M9382L2 Y N Y 91 345/884/80/6.17
3 Int_C_Pst M8383D2 N Y Y 16 375/984/71/0
4 C_Pre_Pst M0382V2 Y Y Y 17 399/1056/91/0
5 FPM_No_Sc M048442 N N N 115 364/849/91/0
6 Pre_C_Nsc MP381P2 Y N N 124 329/850/96/0
7 Pst_C_Nsc MM38472 N Y N 60
381/1022/100/1.02
8 Pr_Pst_Ns MA384J2 Y Y N 82 398/1018/83/4.13
DRY PROGRAM ON SCRUBBER USED
9 Pr_Pst_Ns MR38202 Y Y N 9750
2157/7420/421/34.5
10 Pst_C_Nsc MR38432 N Y N 16000
1510/3765/272/10.8
11 Pre_C_Nsc MR383U2 Y N N 13000 MAXED
12 FPM_No_Sc MY382X2 N N N 22400 MAXED
13 C_Pre_Pst MZ381E2 Y Y Y 980
1035/2214/133/5.42
14 Int_C_Pst MZ383D2 N Y Y 1870
1115/2556/187/2.18
15 Int_C_Pre MU38402 Y N N 24500
2218/6158/586/11.6
16 PARTICLE MONITOR 12K - SCRUB ONLY 42 5/56/0/0
|
| 43.4 | CABOT SLURRY PHASE 1 | SUBPAC::DAWSON | | Mon May 19 1997 10:57 | 53 |
| Subj: Cabot WA400(Alumina 6%) / Fe400(oxidizer 10%)
PHASE 1:
- Strip the Westech and install new pads and carrier(DF200)...DONE
- Drain both slurry tanks. CLOSE supply and return lines to the Auriga so
we don't have to fill that volume with slurry.....DONE
- Fill Oxide tank with SC112....DONE
- Mix ~1L of Cabot slurry 1:1 (WA400-3%:Fe400-5%). dump into W slurry tank and
circulate through lines and dump slurry....DONE
LITER WOULD NOT PUMP OUT OF LINES.
- Mix ~8L of slurry 1:1 and put in W slurry tank.....DONE
4 LITERS OF W400 / 4 LITERS OF Fe400, APPX ~9 LITERS
- Process 4-5 dummy wafers on primary platen followed by 1um W monitor and
12kA oxide wafer for 2 min. Record removal rate and uniformity....DONE
CONDITION = 3/W WAFERS/175ML ALL 3 PHASES FOR 30 SEC 37/61/5.1
1/W WAFER 60 SEC 1UM/12K FOR 120 SEC 175ML 37/61/5.1
W/RR = 4201/2100� MIN 21.78% UNF.
OX/RR= 37/18� MIN R=70 STD = 16�
SELECTIVITY = 117�
- Process 4-5 dummy wafers on secondary pad followed by 1 12kA for 2 min to
check removal rate/ uniformity, and particles....DONE
CONDITION = OX WAFERS/ 250ML PHASE 1 190ML PHASE 2 FOR 60 SEC
3/OX WAFERS 60 SEC 2/OX WAFERS FOR 2 MIN
OX RR = 2094/1047� MIN 308� STD
PARTICLES DELTA = 96-123-0 (9500 RECIPE)
WCMP RECIPE USED ON SCRUBBER
- Process 1 5.7kA wafer through FPM for particles.....DONE
CONDITION = 5700� W/WAFER 175ML 37/61/5.1 30 SEC OX/BUFF
PARTICLE DELTA = 190-588-0 (8000� URECIPE)
WCMP RECIPE USED ON SCRUBBER
- If particles are exceptional and selectivity very good process a contact
patterned wafer from YD0161 through the FPM flow and save for AFM/SEM...DONE
CONDITION = 4 MIN TO CLEAR 30 SEC OX BUFF/WCMP SCRUBBER RECIPE USED
- Run more wafers and check removal rate/ uniformity on primary platen at the
end of the slurry batch.....DONE...4654/2326 RR 25.7% UNF.
**** NO CITRIC WAS USED TO CLEAN ANY OF THE WAFERS. ****
|
| 43.4 | Speedfam MQC checks 5/28/97 | SUBPAC::DANOCONNOR | | Wed May 28 1997 16:55 | 14 |
| Speedfam Results 5/28/97
Carrier Position 180 mm 188 mm
1 2260/4.7 2569/13.8
2 2269/8.2 2565/15.8
3 2318/5.1 2769/17.7
4 2266/4.6 2568/12.7
5 2271/7.0 2667/17.7
The Pad was pulled after the runs due to creases.
/Dan
|
| 43.5 | Panw mqc results 5/29/97 | SUBPAC::DAWSON | | Thu May 29 1997 15:22 | 36 |
| - 10 W/monitors ran to clear for breakin ~120sec
- New distrubution cup (ie. madonna), so/so slurry flow looks fine, during wet
mode and flush of slurry lines water splashes up onto multihead, to much di
flow I'll assume
- Secondary table recipe changed to land at 107lbs & also polish at 107.
- Vibration still noticed during 107df/ slow carrier sp/37 table did
not vibrate (sp?) during 80df 90 carrier sp.
- 1% citric used on scrub.c1, only fpm monitors and 2nd table mqc's got this.
- wafers pst measured at 180mm
- ~6 carrier screws needed to be retighten w/lock tight after mqc run.
- All mqc data entered into workstream
- scrubber brushes changed
- pad changed to a "u" style
Second Table Particle Delta 12k recipe / 2nd Table rr
1. 36-248-0 scrubber (.d1) imprint 1. 717 7.25
2. 16-103-0 No imprint 2. 666 11.7
3. 18-121-0 scubber imprint 3. 687 14.5
4- 7-49-0 No imprint 4. 703 7.54
5- 23-182-0 Imprint 5. 615 13.9
avg 678/ rng 102 avg 10.789/ rg 7.25
FPM Particle Delta 8k recipe W/rr/min unf rnge
1. 213-705-0 scrubber (.d1) imprint 1. 2035 5.06 888
2. 187-588-0 " " 2. 1938 6.79 1018
3. 195-547-0 " " 3. 2047 7.03 1294
4. 207-533-0 No imprint 4. 1963 6.22 903
5. 229-687-0 " " 5. 2052 8.22 1577
avg = 2007 6.66 1136
rr/range = 114� unf.rnge = 3.16
W/Ox/rr unf
1. 38 12�
2. 43 25
3. 37 13
4. 37 18
5. 48 34 selectivity = 51.9/1
|
| 43.6 | PANU MQC DATA | SUBPAC::DAWSON | | Fri May 30 1997 16:14 | 34 |
| - ~2 hours lost due to wafer detection system cal's
- Pad conditioned 2x
- 10 W/monitors ran to clear for breakin ~120sec
- New distrubution cup (ie. madonna), so/so slurry flow looks fine, during wet
mode and flush of slurry lines water splashes up onto multihead, to much di
flow I'll assume
- Secondary table recipe changed to land at 107lbs & also polish at 107.
- Vibration still noticed during 107df/ slow carrier sp/37 table did
not vibrate (sp?) during 80df 90 carrier sp.
- 1% citric used on scrub.c1, only fpm monitors and 2nd table mqc's got this.
- w/rr monitors pst measured at 180mm, more edge removal noticed on the panU.
- All mqc data entered into workstream
w/rr unf rng w/ox/rr unf.
1. 2673 2.99 790 1. 28 na
2. 2726 13.1 2430 2. 33 na
3. 2696 3.08 742 3. 39 na
4. 2638 4.07 804 4. 31 na
5. 2732 8.65 1908 5. 32 na
avg=2693/rg=94 avg=6.38 rng=10.11 avg = 32 rng = 11 sel = 84-1
Sec Delta 12k rr unf.
1. 63-184-0 1. 673 11.7
2. 43-151-0 2. 632 16.1
3. 10-51-0 3. 687 23.1
4- 23-157-0 4. 649 9.5
5- 15-51-0 5. 559 23.7
avg = 659 rng = 146
FPM Delta 8k
1. 41-156-0
2. 31-103-0
3. 98-322-0
4. 207-645-0
5. 261-764-0
|
| 43.7 | PD CMP.D1 5/30/97 | SUBPAC::DAWSON | | Fri May 30 1997 16:20 | 8 |
|
Auriga / CMP.D1 has a PANU pad installed on it. Mqc's were run and
posted in notes and also in workstream. Scrub station brushes were
changed on 5/29. Tool still having isssues w/wafer loss detection
system.
/WCMP
|
| 43.8 | PANU TESTING 6/2/97 | SUBPAC::DAWSON | | Mon Jun 02 1997 16:39 | 43 |
| Monday 6/2/97
- DF. calibration caheck out aok.
- Check out two carrier that had the worse unf. from fridays mqc's.
They were weel w/in spec 5.5 - 6.0.
- Ran Mqc again on PanU style pad.
- Slighty vibration on 1 st set of break'in wafers.
_ Pad notice to have small creases in it. Looks like the pad is starting to
delaminate. This situation was notice 2x so far.
- Ran 5 w/monitors 5/w mqc wafers 5/ox monitors
Result = 3410/1705 5.0...180 mm ox mon. 505/252
3305/1652 7.5 134/67
3471/1735 8.37 55/27
3380/1690 7.27 98/49
3542/1771 10.85 342/171
avg=1711/119 7.8/5.87 avg= 111/rng= 225
- 10 more ox monitors 5w monitors and W mqc performed again.
- 85 wafers on the pad
- All data entered into workstream.
- All wafers in both runs ran on P_2min_mqc
- Results = 4706/2353 5.44
4533/2266 7.65
4763/2383 7.6
4498/2249 6.39
4592/2296 6.39
avg= 2410/137 range 7.37/4.46 range
- Pad to be marathoned for longevity. 20 more liters of slurry mixed A mix
of ox/w wafer will run (ie w - ox - w - ox...). Mqc (w/rr & selt.) will be
checked at the end of each 50 wafers.
- 1 Error "wafer sensor" ajustment made by Bredin, senor went off during
a 1 wafer run.
- 1 Wafer test 1365w/rr 9.2% unf.
- Results = 5370/2685 5.62 34 = ox/rr
5155/2577 7.38 30
5454/2727 8.33 35
5222/2611 4.8 28
5407/2703 7.33 32
avg = 2661/rng150� 6.69/3.53 range 32� rr/ox sel = 83-1
- 40 More liters of slurry made, and 50 more ox/w wafers ran.
- Results of second set to be reveiwed in the am.
|
| 43.9 | PANU MQC INFO. 6/2-6/3 | SUBPAC::DAWSON | | Wed Jun 04 1997 07:07 | 64 |
| Monday 6/2/97
- DF. calibration caheck out aok.
- Check out two carrier that had the worse unf. from fridays mqc's.
They were weel w/in spec 5.5 - 6.0.
- Ran Mqc again on PanU style pad.
- Slighty vibration on 1 st set of break'in wafers.
_ Pad notice to have small creases in it. Looks like the pad is starting to
delaminate. This situation was notice 2x so far.
- Ran 5 w/monitors 5/w mqc wafers 5/ox monitors
Result = 3410/1705 5.0...180 mm ox mon. 505/252
3305/1652 7.5 134/67
3471/1735 8.37 55/27
3380/1690 7.27 98/49
3542/1771 10.85 342/171
avg=1711/119 7.8/5.87 avg= 111/rng= 225
- 10 more ox monitors 5w monitors and W mqc performed again.
- 85 wafers on the pad
- All data entered into workstream.
- All wafers in both runs ran on P_2min_mqc
- Results = 4706/2353 5.44
4533/2266 7.65
4763/2383 7.6
4498/2249 6.39
4592/2296 6.39
avg= 2410/137 range 7.37/4.46 range
- Pad to be marathoned for longevity. 20 more liters of slurry mixed A mix
of ox/w wafer will run (ie w - ox - w - ox...). Mqc (w/rr & selt.) will be
checked at the end of each 50 wafers.
- 1 Error "wafer sensor" ajustment made by Bredin, senor went off during
a 1 wafer run.
- 1 Wafer test 1365w/rr 9.2% unf.
- Results = 5370/2685 5.62 34 = ox/rr
5155/2577 7.38 30
5454/2727 8.33 35
5222/2611 4.8 28
5407/2703 7.33 32
avg = 2661/rng150� 6.69/3.53 range 32� rr/ox sel = 83-1
- 40 More liters of slurry made, and 50 more ox/w wafers ran.
- Results of second set to be reveiwed in the am.
---------------------
Tuseday 6/3/97
- Results combined 187 wafer on the pad.
ox /rr w/rr w/unf.
1. 30 2496 7.23
2. 28 2436 8.84
3. 30 2542 8.57
4. 31 2441 6.10
5. 29 2488 8.46
avg=29 2478/107 7.84/2.27 sel ...85-1
- 50 W/wafers ran for 240 seconds then checked w/rr and selecltivity.
ox/rr w/rr w/unf.
1. 28 1903 26.6
2. 24 2024 14.6
3. 32 2066 12.8
4. 26 2060 11.1
5. 30 2100 13.9
avg= 28/rg 6 2030/197 15.8/ 15.5
242 wafers on this pad
|